Frost & Sullivan has a new report out titled, “World Condition Monitoring Equipment and Services Markets.” That string of words could easily be used to describe the geospatial technology market. After reading the report summary, I learned that this market refers to the equipment that monitors machines in the communications, electronics manufacturing, defense and aerospace and industrial/automotive industries. Yet the pursuit of automation and remote management with the use of wireless sensors for a holistic view of conditions has great parallels to trends in the geospatial arena.
Following is an excerpt from the report summary.
Separate condition monitoring techniques are easier to implement, but have limited capabilities. Hence, the need arises to integrate condition monitoring equipment with plant asset management (PAM) and computerized maintenance management systems (CMMS) of organizations in the pursuit of automation of the maintenance process. This helps in ensuring that results from analysis by different condition monitoring techniques such as vibration monitoring, oil analysis and thermography can be collectively received, offering a holistic view on asset condition and planning predictive rather than periodic maintenance. Condition monitoring equipment vendors hence have to create products that offer computer-based interconnectivity through software to integrate with PAM/CMMS, rather than standalone products.
The integration of sensors with systems is a growing parallel trend in many industries. The ability to combine information from various inputs for the big picture view is obviously a vision that many people share. I’m sure the sensor web community could benefit from some of the knowledge that the World Condition Monitoring Equipment market has amassed. There are also parallels with this equipment monitoring market and the Vital Signs Monitoring market in the healthcare community.
A combination of sensors and geospatial analysis functions and processes will serve to collect the vital signs of our planet.